TLSR827x & TLSR8355 Series

TLSR827x and TLSR8355 series presents the Telink-developed Bluetooth LE + IEEE802.15.4 multi-standard wireless SoC solution with internal Flash and audio support, which combines the features and functions needed for all 2.4GHz IoT standards into a single SoC. The chip supports standards and industrial alliance specifications including Bluetooth Low Energy (up to Bluetooth 5.1), BLE Mesh, 6LoWPAN, Thread, Zigbee, RF4CE, HomeKit, ANT and 2.4GHz proprietary standard.

Overview
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Part Number	SRAM (KB)	Flash (KB)	Tx	Rx	Power Consumption	Protocol	Test Report	Package	Size
TLSR8278F1KET48	64	1MB	+10dBm	-97dBm@BLE1Mbps -100dBm@802.15.4	Power@3V: TXwholechip5.4mA@0dBm RXwholechip5.3mA SleepwithSRAM:~1uA Sleepwithexternal_wakeup:0.4uA	Multimode BLE5.1+2.4G+mesh	Reliability	QFN48-SIP	7x7x0.75mm-0.5
TLSR8273F512ET32	64	512	+10dBm	-97dBm@BLE1Mbps -100dBm@802.15.4	Power@3V: TXwholechip5.4mA@0dBm RXwholechip5.3mA SleepwithSRAM:~1uA Sleepwithexternal_wakeup:0.4uA	BLE5.1+2.4G		QFN32-SIP	7x7x0.75mm-0.5
TLSR8271F512ET32	32	512	+10dBm	-97dBm@BLE1Mbps -100dBm@802.15.4	Power@3V: TXwholechip5.4mA@0dBm RXwholechip5.3mA SleepwithSRAM:~1uA Sleepwithexternal_wakeup:0.4uA	BLE5.1+2.4G	Reliability	QFN32-SIP	5x5x0.75mm-0.5
TLSR8271F512ET24	32	512	+10dBm	-97dBm@BLE1Mbps -100dBm@802.15.4	Power@3V: TXwholechip5.4mA@0dBm RXwholechip5.3mA SleepwithSRAM:~1uA Sleepwithexternal_wakeup:0.4uA	BLE5.1+2.4G		QFN24-SIP	4x4x0.75mm-0.5
TLSR8355F128ET24	32	128	+10dBm	-97dBm@BLE1Mbps -100dBm@802.15.4	Power@3V: TXwholechip5.4mA@0dBm RXwholechip5.3mA SleepwithSRAM:~1uA Sleepwithexternal_wakeup:0.4uA	2.4G	Reliability	QFN24-SIP	4x4x0.75mm-0.5